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Si Epitaxy

EPI develops and designs epitaxial deposition process according to the requirement of customers’ devices and manufacture.

Single wafer processing and batch processing are both available.
Epi Reactor Wafer Diameter Epi Thickness Epi Resistivity
Single Wafer 125 – 200 mm 0.5 – 120 μm 0.01 – 1000 Ω.cm
Batch Type 100 – 150 mm 1 – 200 μm 0.01 – 200 Ω.cm

Process Flow

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