Si Epitaxy

EPI develops and designs epitaxial deposition process according to the requirement of customers’ devices and manufacture.

Single wafer processing and batch processing are both available.

Epi Reactor

Wafer Diameter

Epi Thickness

Epi Resistivity

Single Wafer

125 – 200 mm

0.5 – 60 μm

0.01 – 1000 Ω.cm

Batch Type

100 – 150 mm

1 – 200 μm

0.01 – 200 Ω.cm

 

Process Flow

03-1